Abstract
Withthedevelopmentofthree-dimensionalintegratedcircuitdevicesto
miniaturization,highperformanceandmulti-function.Solderjointsprovideelectrical
andmechanicalconnectionsbetweenelectricalcomponents,sotheirintegrityand
reliabilityarethedecisivefactorsforthereliableoperationofelectricalcomponents.
Whilereducingthesizeofmicrobumpsandimprovingthefunctionofelectronic
components,theincreaseofcurrentdensityandJouleheatbecomemoreserious,
resultinginexcessivecurrentdensityandhightemperaturegradient
柱状纳米孪晶铜电迁移性能研究-17199字.pdf